Electronic device with integrated micromechanical contacts and cooling system
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United States of America Patent
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Aug 16, 2011
Grant Date -
Apr 17, 2008
app pub date -
Oct 11, 2006
filing date -
Oct 11, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electronic device can comprise a semiconductor die on which can be formed a micromechanical system. The micromechanical system can comprise a plurality of electrically conductive elongate, contact structures, which can be disposed on input and/or output terminals of the semiconductor die. The micromechanical system can also comprise a cooling structure disposed on the semiconductor die.
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