Integrated devices having extruded electrode structures and methods of using same
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United States of America Patent
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Aug 16, 2011
Grant Date -
Dec 30, 2010
app pub date -
Jun 30, 2009
filing date -
Jun 30, 2009
priority date (Note) -
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Abstract
The present disclosure provides electrode structures and integrated electrode structures having one or more conductive materials coextruded with one or more dielectric materials. The disclosed electrode structures can be configured for use as analyte sensors. Also provided, are methods of making and using the electrode structures and integrated electrode structures described herein.
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