Forming method for polymeric laminated wafers comprising different film materials
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United States of America Patent
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Aug 23, 2011
Grant Date -
Sep 7, 2006
app pub date -
Mar 6, 2006
filing date -
Mar 4, 2005
priority date (Note) -
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Abstract
A method of making a polymeric laminated wafer comprising different film materials that are softenable and formable at different softening temperatures corresponding with the film materials. Also disclosed is a laminated wafer wherein a first layer has different thermal properties than a second layer of the wafer.
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