US Patent No: 8,004,082
Number of patents in Portfolio can not be more than 2000
Electronic component formed with barrier-seed layer on base material
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Aug 23, 2011
Issued date -
Feb 19, 2009
filing date -
12/449,128
serial no -
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Abstract
It is an object of the present invention to provide a technology for forming an ULSI fine copper wiring by a simpler method. An electronic component in which a thin alloy film of tungsten and a noble metal used as a barrier-seed layer for an ULSI fine copper wiring is formed on a base material, wherein the thin alloy film has a composition comprising tungsten at a ratio equal to or greater than 60 at. % and the noble metal at a ratio of equal to or greater than 5 at. % and equal to or less than 40 at. %. The noble metal is preferably one or more kinds of metals selected from the group consisting of platinum, gold, silver and palladium.
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First Claim
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
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| 5,417,821 Detection of fluids with metal-insulator-semiconductor sensors | 42 | 1993 | |
| 5,591,321 Detection of fluids with metal-insulator-semiconductor sensors | 21 | 1995 | |
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| 2009/0233,441 INTERCONNECTIONS FOR INTEGRATED CIRCUITS | 1 | 2008 | |
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| 4,613,404 Materials which exhibit a surface active effect with vacuum baked photoresists and method of using the same | 8 | 1984 | |
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| 4,996,116 Enhanced direct bond structure | 28 | 1989 | |
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| 5,855,995 Ceramic substrate for implantable medical devices | 54 | 1997 | |
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| 5,382,817 Semiconductor device having a ferroelectric capacitor with a planarized lower electrode | 61 | 1993 | |
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| 2010/0096,756 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2 | 2008 | |
Patent Citation Ranking
Maintenance Fees
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