Post passivation interconnection structures
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United States of America Patent
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Aug 30, 2011
Grant Date -
Mar 9, 2006
app pub date -
Dec 20, 2004
filing date -
Sep 9, 2004
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Abstract
A system and method for forming post passivation metal structures is described. Metal interconnections and high quality electrical components, such as inductors, transformers, capacitors, or resistors are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer.
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