Transducer with fluidly isolated connection
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United States of America Patent
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Sep 6, 2011
Grant Date -
Mar 18, 2010
app pub date -
Nov 20, 2009
filing date -
May 3, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A transducer for use in a harsh environment including a substrate and a transducer die directly coupled to the substrate by a bond frame positioned between the substrate and the transducer die. The transducer die includes a transducer element which provides an output signal related to a physical characteristic to be measured, or which receives an input signal and responsively provides a physical output. The transducer further includes a connecting component electrically coupled to the transducer element at a connection location that is fluidly isolated from the transducer element or the surrounding environment by the bond frame. The bond frame is made of materials and the connecting component is electrically coupled to the transducer element by the same materials of the bond frame, and the connecting component is electrically isolated from the bond frame.
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