Semiconductor processing components and semiconductor processing utilizing same
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United States of America Patent
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Sep 13, 2011
Grant Date -
Mar 2, 2006
app pub date -
Aug 23, 2005
filing date -
Aug 24, 2004
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Abstract
A semiconductor processing component includes a substrate and a layer overlying the substrate. The layer has a composition ReA.sub.yO.sub.1.5+2y, wherein Re is Y, La, a Lanthanoid series element, or a combination thereof, A is (Si.sub.1-aGe.sub.a), 0.25.ltoreq.y.ltoreq.1.2, and 0.ltoreq.a.ltoreq.1.
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