Method for fabricating micro-lens and micro-lens integrated optoelectronic devices using selective etch of compound semiconductor
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United States of America Patent
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Sep 20, 2011
Grant Date -
Mar 12, 2009
app pub date -
Nov 28, 2006
filing date -
Nov 28, 2005
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Abstract
Provided are a method of fabricating a microlens using selective etching of a compound semi-conductor and a method of fabricating a photoelectric device having the microlens. The formation of the microlens includes patterning a compound semiconductor layer and removing a lateral surface of the compound semiconductor layer to form a roughly hemispheric lens. The lateral surface of the compound semiconductor layer is removed by a digital alloy method. In particular, the lateral surface of the compound semiconductor layer is removed by a wet etching process.
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