Encapsulant cavity integrated circuit package system and method of fabrication thereof
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United States of America Patent
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Sep 20, 2011
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app pub date -
Sep 28, 2010
filing date -
Mar 31, 2005
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Abstract
A method for fabricating an encapsulant cavity integrated circuit package system includes: forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity.
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