Semiconductor device
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United States of America Patent
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Sep 20, 2011
Grant Date -
Nov 13, 2008
app pub date -
Apr 21, 2008
filing date -
Apr 27, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device includes a lead frame having an element support and a lead portion. The lead frame has an area from the element support to inner leads of the lead portion, which is formed flat. First and second semiconductor elements are stacked in order on a lower surface of the lead frame. Electrode pads of the first semiconductor element are connected to the inner leads via first metal wires. Ends of the first metal wires, which are connected to the first semiconductor element, are embedded in the second adhesive layer of the second semiconductor element.
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