Memory module, method and memory system having the memory module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8023304
APP PUB NO 20050170673A1
SERIAL NO

11019674

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The memory module includes a plurality of memory devices, a first connector and a second connector. The first connector is disposed at a first position on the memory module. The first connector is configured to carry low-speed signals for the memory devices. The second connector is disposed at a second position on the memory module, different from the first position. The second connector is configured to carry high-speed signals for at least one of the memory devices. The high-speed signals are a higher speed form of signaling than the low-speed signals. The memory system may include at least one slot electrically connected to a chip set and at least one memory module electrically connected to the slot via the first connector. A transmission line such as a fiber optic cable electrically connects the second connector and the chip set.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677 16677

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Jung-hwan Suwon-si, KR 112 1130

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