Method for manufacturing printed circuit board
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United States of America Patent
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Sep 27, 2011
Grant Date -
Apr 2, 2009
app pub date -
Jan 22, 2008
filing date -
Sep 28, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of manufacturing a printed circuit board is disclosed. A method of manufacturing a printed circuit board, which includes: forming at least one interlayer connector on a first carrier, stacking at least one insulation layer on the first carrier such that the interlayer connector is exposed, removing the first carrier, and forming at least one circuit pattern on the insulation layer such that the circuit pattern is electrically coupled with the interlayer connector, can be used to increase the density of circuit patterns, as the method can provide electrical connection between circuit patterns and vias without using lands.
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