System for measuring and controlling the level of vacuum applied to a conditioning holder within a CMP system
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United States of America Patent
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Sep 27, 2011
Grant Date -
N/A
app pub date -
Jan 31, 2011
filing date -
May 29, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method and apparatus for conditioning polishing pads that utilizes an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The method and apparatus utilizes a vacuum capability to pull waste material out of the polishing pad and through the apertured conditioning disk to evacuate the apparatus through an outlet port. The apparatus also includes a force adjustment system for providing measurement and control of the force applied by the conditioning disk to the polishing pad.
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