Stacked integrated circuits package system with passive components
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United States of America Patent
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Sep 27, 2011
Grant Date -
Sep 13, 2007
app pub date -
Mar 10, 2006
filing date -
Mar 10, 2006
priority date (Note) -
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Abstract
A stacked integrated circuit package system is provided forming a first stack layer having a first integrated circuit die on a first substrate, forming a second stack layer having a second integrated circuit die on a second substrate, and mechanically and electrically connecting a spacer layer having a first passive component between the second stack layer and the first stack layer.
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