Method of forming a single-layer metal conductors with multiple thicknesses
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United States of America Patent
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Sep 27, 2011
Grant Date -
Mar 26, 2009
app pub date -
Sep 26, 2007
filing date -
Sep 26, 2007
priority date (Note) -
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Abstract
A pattern that includes trenches of different depths is formed on a substrate using nanoimprint lithography. A subsequent metal deposition forms lines of different thicknesses according to trench depth, from a single metal layer. Vias extending down from lines are also formed from the same layer. Individual bit lines are formed having different thicknesses at different locations.
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