Multi-dielectric material circuit board supporting high-speed and low-speed signaling
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United States of America Patent
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Sep 27, 2011
Grant Date -
Mar 20, 2008
app pub date -
Oct 30, 2007
filing date -
Feb 5, 2002
priority date (Note) -
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Abstract
A circuit board comprises a center segment distributing power and low-speed signaling, and outer segments for high-speed signaling. The segments use dielectric materials with different dielectric constants, with the outer segments supporting higher-speed signal transmission.
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