Wireless radio frequency technique design and method for testing of integrated circuits and wafers
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United States of America Patent
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Sep 27, 2011
Grant Date -
Jul 12, 2007
app pub date -
Feb 26, 2007
filing date -
May 15, 2000
priority date (Note) -
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Abstract
Various embodiments are described herein for an apparatus and method for the wireless testing of Integrated Circuits and wafers. In one embodiment, the apparatus comprises a test unit external from the wafer and at least one test circuit that is fabricated on the wafer that contains the Integrated Circuit. The test unit transmits an RF signal to power the test circuit. The test circuit, comprising configurable circuitry, performs a series of parametric tests at the normal operating frequency of the Integrated Circuit and transmits the test results to the test unit for analysis.
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