Ink ejection mechanism with thermal actuator coil
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United States of America Patent
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-
Oct 4, 2011
Grant Date -
May 12, 2011
app pub date -
Jan 12, 2011
filing date -
Jul 15, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A micro-electromechanical ejection mechanism is disclosed for ejecting an ink droplet. The mechanism has a wafer substrate and an ink chamber formed on the wafer substrate. The ink chamber has an ink ejection nozzle formed in a roof thereof and an ink inlet port formed in a floor thereof. A paddle device is arranged inside the ink chamber between the inlet port and the ejection nozzle A bi-layer thermal actuator coil is also included with a first end thereof fast with the substrate and a second end connected to the paddle device. Heating of the thermal actuator coil displaces the paddle device, causing ejection of an ink droplet through the ink ejection nozzle.
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