Stacked semiconductor package having adhesive/spacer structure and insulation
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United States of America Patent
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Oct 4, 2011
Grant Date -
Jan 25, 2007
app pub date -
Sep 28, 2006
filing date -
May 24, 2004
priority date (Note) -
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status (Latency Note)
Importance
Abstract
Stacked semiconductor assemblies in which a first die is mounted active side upward on a first substrate and is electrically interconnected to the substrate by wire bonding; an adhesive/spacer structure is formed upon the active side of the first die; and a device such as a die or a package or a heat spreader, having an electrically nonconductive side, is mounted upon the adhesive/spacer structure with the electrically nonconductive side facing the first wire bonded die. The side of the device facing the first wire bonded die may be made electrically nonconductive by having an electrically insulating layer, such as a dielectric film adhesive. Also, methods for making the assemblies are disclosed.
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Cited Art Landscape
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