Thermal sensing and reset protection for an integrated circuit chip
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United States of America Patent
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Oct 4, 2011
Grant Date -
Nov 26, 2009
app pub date -
May 8, 2009
filing date -
May 21, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
There is provided a semiconductor package that includes a first semiconductor die mounted on a package substrate. The semiconductor package further includes a second semiconductor die mounted on the first semiconductor die and including a thermal sensing and reset protection circuit. The thermal sensing and reset protection circuit is configured to determine a temperature of the first semiconductor die and to provide a reset protection signal to the first semiconductor die when the temperature of the first semiconductor die is substantially equal to a preset temperature so as to protect the first semiconductor die from thermal runaway. The reset protection signal can cause the first semiconductor die to be in a sleep mode or a reset state.
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