Method for mounting a thinned semiconductor wafer on a carrier substrate
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United States of America Patent
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Oct 11, 2011
Grant Date -
Feb 11, 2010
app pub date -
Aug 7, 2008
filing date -
Aug 7, 2008
priority date (Note) -
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Abstract
A method for mounting a thinned semiconductor wafer on a carrier substrate for further processing is disclosed. The method consists of a series of steps, which is based on providing a frame with a double-side tape to mount the thinned wafer on the carrier substrate. The frame is used to support the double-side tape and can be designed to fit the conventional production line for holding, picking and transferring wafers. The carrier substrate can be a sapphire substrate, a quartz substrate or other substrates that can sustain further processing, such as thermal treatments and/or chemical etchings. The method of the present invention not only prevents possible damages to the highly brittle chip after wafer thinning, but also fits the conventional production line for processing semiconductor wafers.
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