Segmented grinding wheel and manufacturing method therefor
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United States of America Patent
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Oct 11, 2011
Grant Date -
Oct 14, 2010
app pub date -
Nov 13, 2006
filing date -
Dec 28, 2005
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A plurality of segmented chips are reinforced by applying an adhesive to the circumferentially opposite end portions thereof, and the adjoining segmented chips adjoining in the circumferential direction are adhered to the circumferential surface of a disc-like core with the adhesives at the circumferentially opposite end portions being not jointed with each other. Thus, the segmented chips can be prevented from being loaded with an unnatural force even when the disc-like core with the segmented chips adhered thereto expands and contracts radially due to thermal expansion and thermal contract. Thereby, expansion and contraction of the disc-like core do not impose a compression stress or the like on adhesives situated between adjoining segmented chips.
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