Power receptacle with enlarged heat dissipation path formed on mating face and power connector assembly thereof
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United States of America Patent
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-
Oct 18, 2011
Grant Date -
N/A
app pub date -
Nov 23, 2010
filing date -
Sep 13, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A power connector assembly includes mateable power receptacle and power plug. The power receptacle includes an insulative housing and a number of receptacle power contacts received in the insulative housing. The insulative housing includes a mating surface, a mounting surface, a first slot recessed from the first mating surface, and a first through hole extending through the mounting surface to be exposed to an exterior. The first through hole is in communication with the first slot in order to form a heat dissipation path for eliminating heat generated by the receptacle power contacts.
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