Composition for removing photoresist layer and method for using it
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United States of America Patent
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Oct 18, 2011
Grant Date -
Apr 23, 2009
app pub date -
May 12, 2006
filing date -
May 13, 2005
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A composition for removing a photoresist layer and a method for using it are disclosed. The composition comprises a chemical portion which includes water and chemical constituents dissolving or softening the photoresist layer and a mechanical portion which is abrasive particles. Using the composition and the method according to the present invention can decrease the conventional two steps of removing a photoresist layer process to one step, thereby simplifying the procedure, shortening the removing time and reducing the cost. The chemical constituents in the composition according to the present invention are of low toxicity and flammability and the amount used is small, which makes it more friendly with the environment and decreases the expense of disposing the waste.
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