Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof
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United States of America Patent
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Oct 18, 2011
Grant Date -
Oct 14, 2010
app pub date -
Apr 14, 2009
filing date -
Apr 14, 2009
priority date (Note) -
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Abstract
A method of manufacture an integrated circuit packaging system includes: providing a substrate; attaching a first integrated circuit to the substrate by interconnects only along opposite sides of the first integrated circuit; and attaching a heat spreader to the substrate, the heat spreader extending over the first integrated circuit and between the opposite sides of the first integrated circuit.
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