Thin films measurement method and system
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 18, 2011
Grant Date -
Jan 14, 2010
app pub date -
Sep 18, 2009
filing date -
Jun 26, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method and system are presented for use in controlling the processing of a structure. First measured data is provided being indicative of at least one of the following: a thickness (d.sub.2) of at least one layer (L.sub.2) of the structure W in at least selected sites of the structure prior to the processing of the structure, and a surface profile of the structure prior to processing. An optical measurement is applied to at least the selected sites of the structure after processing and second measured data is generated being indicative of at least one of the following: a thickness of the process structure (d') and a surface profile of the processed structure. The second measured data is analyzed by interpreting it using the first measured data to thereby determine a thickness (d'.sub.1 or d'.sub.2) of at least one layer of the process structure. This determined thickness is thus indicative of the quality of the processing.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully