Desiccant in a MEMS device
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United States of America Patent
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Oct 18, 2011
Grant Date -
Nov 22, 2007
app pub date -
May 17, 2007
filing date -
May 17, 2006
priority date (Note) -
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Abstract
A package structure and method for packaging a MEMS device is described. In one embodiment, the MEMS base device can include a substrate having a MEMS device formed thereon, a backplate, an exposed or activated desiccant disposed between the backplate and the transparent substrate, and a cover at least partially encapsulating said desiccant. In another embodiment, a MEMS display device can be manufactured by contacting the substrate and/or backplate with a cover which at least partially encapsulates a desiccant, joining the backplate and the substrate to form a package, and exposing or activating the desiccant.
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