Cutting mold for rigid-flexible circuit board and method for forming the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 25, 2011
Grant Date -
Sep 17, 2009
app pub date -
Jun 2, 2008
filing date -
Mar 12, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A cutting mold for removing two opposite superfluous rigid circuit boards from a rigid-flexible circuit board. A first cutter is connected to a first moldboard. A first barricade is connected to the first moldboard. The maximum vertical distance from the first barricade to the first moldboard exceeds that from the first cutter to the first moldboard. A second moldboard is opposite the first moldboard. The first and second moldboards move with respect to each other. A second cutter is connected to the second moldboard and corresponds to the first cutter. A second barricade is connected to the second moldboard and detachably abuts the first barricade. The maximum vertical distance from the second barricade to the second moldboard exceeds that from the second cutter to the second moldboard. The first and second cutters cut the superfluous rigid circuit boards when the first and second moldboards move toward each other.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully