Maleimide compositions and methods for use thereof
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United States of America Patent
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Oct 25, 2011
Grant Date -
Mar 27, 2008
app pub date -
Apr 12, 2007
filing date -
Oct 21, 2005
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The invention is based on the discovery that compositions containing certain maleimide compounds and aromatic diene compounds are useful as thermosetting resins for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways, with or without a catalyst. In some embodiments, the well-known “ene” reaction can be used to cure the compositions described herein, and therefore no catalyst is required.
First Claim
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International Classification(s)
- C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
- C09J:ADHESIVES; ADHESIVE PROCESSES IN GENERAL
- C08F:MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONL....
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
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