Microlayer structures and methods

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United States of America Patent

PATENT NO 8043696
APP PUB NO 20080254281A1
SERIAL NO

11577385

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Abstract

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Improved microlayer structures and methods typically employing at least 4 stacked layers of polymers (e.g., including alternating layers of components A and B), such as that obtained by coextrusion. The layers each have a thickness of less than about 50 microns. One optional approach involves forming an intermediate form that includes at least one elongated member made from the plurality of layers, from which a shaped composite article may be made.

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Patent Owner(s)

Patent OwnerAddress
DOW GLOBAL TECHNOLOGIES LLC2040 DOW CENTER MIDLAND MI 48674

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Hongyu Lake Jackson, US 185 1443
McLeod, David G Rochester, US 21 446
Wevers, Ronald Terneuzen, NL 60 717

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