Chip package
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United States of America Patent
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Oct 25, 2011
Grant Date -
May 14, 2009
app pub date -
Jan 13, 2009
filing date -
Jun 6, 2005
priority date (Note) -
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Abstract
A chip package includes a bump connecting said semiconductor chip and said circuitry component, wherein the semiconductor chip has a photosensitive area used to sense light. The chip package may include a ring-shaped protrusion connecting a transparent substrate and the semiconductor chip.
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