Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer
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United States of America Patent
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Oct 25, 2011
Grant Date -
Jan 6, 2011
app pub date -
Sep 14, 2010
filing date -
Mar 27, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A sealing apparatus for sealing by resin a semiconductor wafer having semiconductor elements on its surface. The apparatus includes an upper mold and a tower mold having an area where the semiconductor wafer is mounted, the lower mold having an uneven surface in the area and a shock absorber under the lower mold.
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