Electrical property altering, planar member with solder element in IC chip package
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United States of America Patent
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Oct 25, 2011
Grant Date -
Dec 30, 2010
app pub date -
Jun 25, 2009
filing date -
Jun 25, 2009
priority date (Note) -
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Abstract
A structure includes a solder element for electrically coupling a substrate of an integrated circuit (IC) chip package and a printed circuit board (PCB); and a first electrical property altering, substantially planar member positioned between the solder element and at least one of a landing pad of the substrate and a landing pad of the PCB. In another embodiment, the electrical property altering, planar member can be applied to the solder element(s) between the IC chip and the package substrate.
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