Printed circuit board, method of fabricating the same, and electronic apparatus employing the same
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United States of America Patent
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Oct 25, 2011
Grant Date -
Feb 12, 2009
app pub date -
Aug 8, 2008
filing date -
Aug 9, 2007
priority date (Note) -
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Abstract
A printed circuit board includes a core layer, an insulation layer formed on the core layer and having a cavity formed on a part of the insulation layer, and a circuit pattern formed on the insulation layer, wherein the circuit pattern comprises one or more external terminals positioned above the cavity.
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