Integrated circuit on high performance chip
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United States of America Patent
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Nov 1, 2011
Grant Date -
Nov 9, 2006
app pub date -
Jun 23, 2004
filing date -
Jun 24, 2003
priority date (Note) -
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Abstract
A method of fabricating a die containing an integrated circuit, including active components and passive components, includes producing a first substrate containing at least one active component of active components and a second substrate containing critical components of the passive components, such as perovskites or MEMS, and bonding the two substrates by a layer transfer. The method provides an improved monolithic integration of devices such as MEMS with transistors.
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