Methods and systems for laser machining a substrate
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United States of America Patent
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Nov 1, 2011
Issued Date -
N/A
app pub date -
Oct 1, 2002
filing date -
Oct 1, 2001
priority date (Note) -
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Abstract
A formation in a first surface of a substrate is machined by an ultraviolet or visible radiation laser, to a predetermined depth that is less than a full depth of the substrate; and material is removed from a second surface of the substrate opposed to the first surface to the predetermined depth from the first surface to communicate with the formation. Material may be removed by, for example, lapping and polishing, chemical etching, plasma etching or laser ablation. The invention has application in, for example, dicing semiconductor wafers to forming metallised vias in wafers.
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