Intermetal stack for use in a photovoltaic cell
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United States of America Patent
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Nov 1, 2011
Grant Date -
Mar 31, 2011
app pub date -
Sep 30, 2009
filing date -
Sep 30, 2009
priority date (Note) -
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Abstract
A donor silicon wafer may be bonded to a substrate and a lamina cleaved from the donor wafer. A photovoltaic cell may be formed from the lamina bonded to the substrate. An intermetal stack is described that is optimized for use in such a cell. The intermetal stack may include a transparent conductive oxide layer serving as a quarter-wave plate, a low resistance layer, an adhesion layer to help adhesion to the receiver element, and may also include a barrier layer to prevent or impede unwanted diffusion within the stack.
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