Metal structure and fabrication method thereof

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United States of America Patent

PATENT NO 8052810
APP PUB NO 20090176027A1
SERIAL NO

12399589

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Abstract

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A metal structure according to the present invention is unlikely to become brittle and has excellent hardness and creep resistance, characterized in that annealing has been applied at a temperature not more than the temperature at which crystals of the metal material start to become larger. This metal structure includes at least two kinds of metal material, and annealing can be applied at a temperature not more than the temperature at which crystals of the metal material start to become larger. For example, the present invention is advantageous in the manner of a microstructure for a contact probe. A fabricating method according to the present invention is a method of fabricating a metal structure unlikely to become brittle and having excellent hardness and creep resistance, characterized in that the step of applying annealing at a temperature not more than the temperature at which crystals of the metal material start to become larger is included.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTDOSAKA-SHI OSAKA 541-0041

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirata, Yoshihiro Hyogo, JP 106 819
Inazawa, Shinji Osaka, JP 104 675
Okada, Kazunori Hyogo, JP 48 493
Sakata, Teruhisa Amagasaki, JP 5 26
Sakuta, Masao Itami, JP 5 6
Tani, Yoshiaki Amagasaki, JP 23 58

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