Semiconductor device and the method of manufacturing the same

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United States of America Patent

PATENT NO 8053859
SERIAL NO

11817683

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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To provide a semiconductor device that exhibits a high breakdown voltage, excellent thermal properties, a high latch-up withstanding capability and low on-resistance. The semiconductor device according to the invention, which includes a buried insulator region 5 disposed between an n.sup.--type drift layer 3 and a first n-type region 7 above n.sup.--type drift layer 3, facilitates limiting the emitter hole current, preventing latch-up from occurring, raising neither on-resistance nor on-voltage. The semiconductor device according to the invention, which includes a p-type region 4 disposed between the buried insulator region 5 and n.sup.--type drift layer 3, facilitates depleting n.sup.--type drift layer 3 in the OFF-state of the device. The semiconductor device according to the invention, which includes a second n-type region 6 disposed between the first n-type region 7 and the n.sup.--type drift layer 3, facilitates dissipating the heat caused in the channel region or in the first n-type region 7 to a p.sup.+-type collector layer 1a, which is a semiconductor substrate, via the second n-type region 6, n.sup.--type drift layer 3 and an n-type buffer layer 2.

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Patent Owner(s)

Patent OwnerAddress
FUJI ELECTRIC CO LTDKAWASAKI-SHI KANAGAWA 210-9530

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jimbo, Shinichi Ishikawa-gun, JP 7 86
Lu, Hong-fei Matsumoto, JP 27 246

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