Semiconductor package
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United States of America Patent
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Nov 8, 2011
Grant Date -
Jul 15, 2010
app pub date -
Nov 4, 2009
filing date -
Jan 9, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor package includes a chip base material; a capacitor formed on the base material; and a cover formed over the base material to cover the capacitor, and having a side portion and an upper portion. The base material is provided with a bonding pattern connecting the base material and the cover to cover the capacitor. The bonding pattern includes a region A having a substantially uniform pattern width A, and at least one region B having a pattern width B which is larger than the width pattern width A.
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