US Patent No: 8,057,124

Number of patents in Portfolio can not be more than 2000

Method and device for measuring soil parameters by means of compaction machines

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ALSO PUBLISHED AS: 20090166050
ATTORNEY / AGENT: (SPONSORED)
 

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Abstract

A soil compaction device has a vibrated contact element that makes contact with the soil during a contact phase and that is exposed to a contact force exerted by the soil and travels over a contact distance. A dynamic stiffness of the soil is formed from the gradient of the contact force and from the contact distance. Furthermore, a contact surface parameter to take account of the actual contact surface of the contact element with the soil is determined. The dynamic deformation modulus is then the product of the contact surface parameter and the dynamic stiffness. The method allows the determination of the dynamic deformation modulus, and hence of the soil stiffness, during the compaction operation.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
WACKER NEUSON PRODUKTION GMBH & CO. KGMUNICH105

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lange, Dittmar - 2 0
Stenzel, Otto W Neuhutten, DE 28 67
Wagner, Stefan Schweinfurt, DE 27 16

Cited Art

Patent Info (Count) # Cites Year
 
WACKER NEUSON PRODUKTION GMBH & CO. KG (3)
6,213,681 Soil compacting device with adjustable vibration properties 12 1999
6,846,128 Mobile soil compacting device whose direction of travel is stabilized 6 2003
6,808,336 Oscillation detecting device for compacting soil 1 2003
 
BOMAG GMBH (1)
6,619,125 Method and device for determining the degree of compaction during ground compaction 5 2001
 
SAKAI HEAVY INDUSTRIES, LTD. (1)
6,752,567 Apparatus for managing degree of compaction in a vibratory compact vehicle 12 2002

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