Microelectronic packages and methods therefor
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United States of America Patent
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Nov 15, 2011
Issued Date -
N/A
app pub date -
Dec 23, 2005
filing date -
Dec 23, 2005
priority date (Note) -
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Abstract
A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remote from the surface of the substrate. The method includes compressing the at least two conductive elements so that the remote surfaces thereof lie in a common plane, and after the compressing step, providing an encapsulant material around the at least two conductive elements for supporting the microelectronic package and so that the remote surfaces of the at least two conductive elements remain accessible at an exterior surface of the encapsulant material.
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