Reversible leadless package and methods of making and using same
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United States of America Patent
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Nov 15, 2011
Grant Date -
Sep 2, 2010
app pub date -
Mar 8, 2010
filing date -
Aug 26, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for manufacturing a semiconductor device package including an electrically conductive lead frame having a plurality of posts disposed at a perimeter of the package. Each of the posts has a first contact surface at the first package face and a second contact surface at the second package face. The lead frame also includes a plurality of post extensions disposed at the second package face. Each of the post extensions includes a bond site formed on a surface of the post extension opposite the second package face. At least one I/O pad on the semiconductor device is electrically connected to the post extension at the bond site using wirebonding, tape automated bonding, or flip-chip methods. The package can be assembled using a lead frame having pre-formed leads, with or without taping, or using partially etched lead frames. A stack of the semiconductor device packages may be formed.
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