Method for producing semiconductor components and thin-film semiconductor component
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United States of America Patent
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Nov 15, 2011
Grant Date -
Jun 3, 2010
app pub date -
Aug 4, 2006
filing date -
Aug 5, 2005
priority date (Note) -
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Abstract
The invention relates to a method for producing semiconductor components, wherein a layer composite (6) containing a semiconductor material is formed on a growth substrate (1), a flexible carrier layer is applied to the layer composite (6), the flexible carrier layer is cured to form a self-supporting carrier layer (2), and the growth substrate (1) is stripped away. As an alternative, the carrier layer (2) may have a base layer (2b) and an adhesion layer (2a) adhering on the layer composite.
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