Circuit board and manufacturing method thereof
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United States of America Patent
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Nov 15, 2011
Grant Date -
Aug 20, 2009
app pub date -
Aug 18, 2008
filing date -
Feb 19, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A manufacturing method of a circuit board is provided. A metal core is provided. A conductive layer is formed on each of some carriers. The carriers and dielectric layers are laminated at both sides of the metal core to form a stacked structure. Each of the dielectric layers is located between the corresponding carrier and the metal core, and a portion of the conductive layer is embedded in the corresponding dielectric layer. Then, the carriers are removed. A blind via and/or a through via are/is formed in the stacked structure to connect the corresponding conductive layer and the metal core and/or connect the conductive layers at both sides of the metal core, wherein the through via penetrates the metal core. The conductive layer on a surface of the dielectric layer is removed.
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