Semiconductor package
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United States of America Patent
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Nov 15, 2011
Grant Date -
May 20, 2010
app pub date -
Nov 19, 2008
filing date -
Nov 19, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads in a first horizontal plane disposed along peripheral edges of the die pad; a ground bar downset from the first horizontal plane to a second horizontal plane between the leads and the die pad; a plurality of downset tie bars connecting the ground bar with the die pad; a plurality of ground wires bonding to both of the ground bar and the die pad; and a molding compound at least partially encapsulating the die pad, inner ends of the leads such that bottom surface of the die pad is exposed within the molding compound.
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