Probe card assembly with interposer probes
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United States of America Patent
Stats
-
Nov 15, 2011
Grant Date -
Jul 23, 2009
app pub date -
Jan 23, 2008
filing date -
Jan 23, 2008
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A probe test card assembly for testing a device under test includes interposer probes to connect a printed circuit board to a substrate. The probe test card assembly includes a printed circuit board, a substrate and a substrate holder. A plurality of test probes is connected to the substrate for making electrical contact with the device under test. A plurality of interposer probes is attached to the substrate for providing electrical connections between the substrate and the printed circuit board. The substrate holder holds the substrate in position with respect to the printed circuit board so that the interposer probes contact the printed circuit board. The interposer probes may be arranged in interposer probe groups to facilitate maintenance and replacement of the interposer probes. Hardstop elements may also be used to protect the interposer probes.
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