High throughput method of in transit wafer position correction in system using multiple robots
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United States of America Patent
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Nov 15, 2011
Grant Date -
Jun 4, 2009
app pub date -
Nov 30, 2007
filing date -
Nov 30, 2007
priority date (Note) -
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Abstract
Methods correcting wafer position error are provided. The methods involve measuring wafer position error on a robot, e.g. a dual side-by-side end effector robot, during transfer to an intermediate station. This measurement data is then used by a second robot to perform wafer pick moves from the intermediate station with corrections to center the wafer. Wafer position correction may be performed at only one location during the transfer process. Also provided are systems and apparatuses for transferring wafers using an intermediate station.
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