Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby
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United States of America Patent
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Nov 22, 2011
Grant Date -
Mar 18, 2010
app pub date -
Nov 23, 2009
filing date -
Sep 27, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of forming a sensor for sensing a physical property of a media. A substrate is provided having circuitry thereon including at least one electrical contact and a die is provided having disposed thereon corresponding electrical contacts and a sensing element for sensing a physical property of a media applied to said sensing element. One or more bonding ring or portions are arranged on the die. The die electrical contact(s) and bonding ring(s) can be bonded substantially simultaneously, with conductive bonding material, to the corresponding substrate electrical contact(s) and a surface of said substrate, respectively, to thereby form a sensor. The bonding ring(s) form a pressure seal. The substrate can include corresponding bonding ring(s). The die can include an ASIC for compensating temperature effects on said pressure sensor.
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