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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
SHENZHEN XINGUODU TECHNOLOGY CO LTD	17TH FLOOR JINSONG MANSION TERRA INDUSTRIAL & TRADE PARK FUTIAN SHENZHEN

International Classification(s)

• B29B:PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE ....
• B01F:MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Low, Boon Yew	Petaling Jaya, MY	31	119
Manikam, Vermal Raja	Shah Alam, MY	1	2
Manikam, Vittal Raja	Shah Alam, MY	4	8

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
November 22, 2011	US,8062424,B2   US8062424B2	GRANTED PATENT AS SECOND PUBLICATION
May 19, 2011	US,20110115125,A1   US20110115125A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 8062424

Method and apparatus for molding substrate

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